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 19-2047; Rev 4; 5/10
12-Bit + Sign Digital Temperature Sensors with Serial Interface
General Description
The MAX6629-MAX6632 are local digital temperature sensors with an SPITM-compatible serial interface. The temperature is converted to a 12-bit + sign word with a resolution of 0.0625C/LSB. An extended temperature range provides useful readings up to +150C. These sensors are 3-wire serial interface SPI compatible, allowing the MAX6629-MAX6632 to be readily connected to a variety of microcontrollers (Cs). The MAX6629-MAX6632 are read-only devices, simplifying their use in systems where only temperature data is required. All four digital temperature sensors require very little supply current, making them ideal for portable systems. The MAX6631/MAX6632 perform a temperature-to-digital conversion once every 8s and require minimal average supply current, 32A (typ). The MAX6629/ MAX6630 perform a conversion once every 0.5s and require only 200A (typ) supply current. Any of these temperature sensors can perform conversions more often--up to approximately four conversions per second by reading the conversion results more often. Low Power Consumption 32A typ (MAX6631/MAX6632) 200A typ (MAX6629/MAX6630) 12-Bit + Sign Resolution with 0.0625C/LSB Accuracy 1C (max) from 0C to +70C +150C Extended Temperature Range SPI-Compatible Serial Interface +3.0V to +5.5V Supply Range 6-Pin TDFN and SOT23 Packages Lead-Free Version Available (TDFN Package)
Features
MAX6629-MAX6632
Ordering Information
PART MAX6629MTT+ MAX6629MUT MAX6630MTT+ MAX6630MUT MAX6631MTT+ MAX6631MUT MAX6632MTT+ MAX6632MUT TEMP RANGE -55C to +125C -55C to +125C -55C to +125C -55C to +125C -55C to +125C -55C to +125C -55C to +125C -55C to +125C PIN-PACKAGE 6 TDFN-EP* 6 SOT23-6 6 TDFN-EP* 6 SOT23-6 6 TDFN-EP* 6 SOT23-6 6 TDFN-EP* 6 SOT23-6
Applications
Cellular Hard Disk Drive HVAC
SPI is a trademark of Motorola, Inc.
Automotive Industrial Control Systems
+Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad.
Typical Application Circuit
+3V TO +5.5V VCC
Pin Configurations
TOP VIEW
0.1F
MAX6629 MAX6630 MAX6631 MAX6632
N.C. 1
6
SO
GND 1
6
SO
SO
GND 2
MAX6629 MAX6631
5
CS
N.C. 2
MAX6630 MAX6632
5
CS
C
CS
VCC 3
4
SCK
VCC 3
4
SCK
SOT23 TDFN
GND SCK
SOT23 TDFN
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
12-Bit + Sign Digital Temperature Sensors with Serial Interface MAX6629-MAX6632
ABSOLUTE MAXIMUM RATINGS
All Voltages Referenced to GND VCC ...........................................................................-0.3V, +6.0V SO, SCK, CS ....................................................-0.3V, VCC + 0.3V SO .......................................................................-1mA to +50mA Current into Any Pin ............................................................10mA Continuous Power Dissipation (TA = +70C) 6-Pin SOT23 (derate 9.10mW/C above +70C)..........727mW 6-Pin TDFN (derate 24.4mW/C above +70C) .........1951mW Note: Junction Temperature ......................................................+150C Operating Temperature Range (Note 1) ...........-55C to +150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C Soldering Temperature (reflow) TDFN ............................................................................+260C SOT23 (Ordering Information contains "#") .................+245C SOT23 (Ordering Information contains "-")..................+240C
It is not recommended to operate the device above +125C for extended periods of time.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +3.0V to +5.5V, TA = -55C to +125C, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25C.) (Notes 2 and 3)
PARAMETER TEMPERATURE TA = room temp, VCC = +3.3V 0C -20C Accuracy -20C -40C TA Power-Supply Sensitivity Resolution Time Between Conversion Starts Conversion Time POWER SUPPLY Supply Voltage Range Supply Current, SCK Idle VCC I SD I IDLE ICONV Average Operating Current Power-On Reset (POR) Threshold ICC Shutdown (Note 3), VCC = +0.8V ADC idle (Figure 2), CS = low ADC converting (Figure 2) MAX6629, MAX6630 MAX6631, MAX6632 VCC falling 6 360 200 32 1.6 3.0 5.5 5 20 650 400 50 A V A V t SAMPLE tCONV MAX6629, MAX6630, CS high MAX6631, MAX6632, CS high PSS 0.0625 0.37 5.9 180 0.5 8 250 0.65 10.5 320 TA TA TA TA +70C, VCC = +3.3V +85C, VCC = +3.3V +100C, VCC = +3.3V +125C, VCC = +3.3V -0.8 -1.0 -1.6 -2.3 -3.2 -1.0 -5.0 0.2 0.2 +0.3 +0.5 +0.8 +1.5 +1.5 0.2 +0.8 +1.0 +1.6 +2.3 +3.2 +3.5 +6.5 0.6 C/V C s ms C SYMBOL CONDITIONS MIN TYP MAX UNITS
-55C, VCC = +3.3V
TA = +150C, VCC = +3.3V
2
_______________________________________________________________________________________
12-Bit + Sign Digital Temperature Sensors with Serial Interface
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +3.0V to +5.5V, TA = -55C to +125C, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25C.) (Notes 2 and 3)
PARAMETER LOGIC INPUTS (CS, SCK) Logic Input Low Voltage Logic Input High Voltage Input Leakage Current LOGIC OUTPUTS (SO) Output Low Voltage Output High Voltage Serial Clock Frequency SCK Pulse Width High SCK Pulse Width Low CS Fall to SCK Rise CS Fall to Output Enable CS Rise to Output Disable SCK Fall to Output Data Valid VOL VOH f SCL tCH tCL tCSS tDV tTR tDO CLOAD = 10pF CLOAD = 10pF CLOAD = 10pF CLOAD = 10pF 100 100 80 80 50 80 I SINK = 1.6mA I SOURCE = 1.6mA VCC - 0.4 5 0.4 V V MHz ns ns ns ns ns ns VIL VIH ILEAK VIN = V GND or +5.5V 0.7 x VCC 1 5 0.3 x VCC V V A SYMBOL CONDITIONS MIN TYP MAX UNITS
MAX6629-MAX6632
TIMING CHARACTERISTICS (Notes 4 and 5)
Note 2: Tested at a single temperature. Specifications over temperature are guaranteed by design. Note 3: The MAX6629-MAX6632 are not specifically equipped with a shutdown function. Their low supply current permits powering them from the output of a logic gate. This specification is given to ensure that the MAX6629-MAX6632 do not draw excessive currents at low supply voltages, ensuring reliable operation from a gate output. Note 4: Timing characteristics are guaranteed by design and are not production tested. Note 5: CLOAD = total capacitance of one bus line in picofarads.
_______________________________________________________________________________________
3
12-Bit + Sign Digital Temperature Sensors with Serial Interface MAX6629-MAX6632
Typical Operating Characteristics
(VCC = +3.3V, TA = +25C, unless otherwise noted.)
OPERATING SUPPLY CURRENT vs. TEMPERATURE
VCC = +5.5V 350 SUPPLY CURRENT (A) 300 250 200 150 MAX6629 100 -55 -30 -5 20 45 70 95 120 145 TEMPERATURE (C) VCC = +3.3V VCC = +3.6V VCC = +3.0V VCC = +4.5V
MAX6629-32 toc01
POWER-ON RESET (POR) THRESHOLD vs.TEMPERATURE
MAX6629-32 toc02
TEMPERATURE ERROR vs. TEMPERATURE
MAX6629-32 toc03
400 VCC = +5.0V
2.6 2.4 POWER-ON RESET THRESHOLD (V) 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 -55 -30 -5 20 45 70 95 120 145 TEMPERATURE (C)
3 2 TEMPERATURE ERROR (C) 1 0 -1 -2 -3 -4 -55 -30 -5 20 45 70 TEMPERATURE (C) MAX6629 95 120 145
TEMPERATURE ERROR vs. POWER-SUPPLY NOISE FREQUENCY
MAX6629-32 toc04
RESPONSE TO THERMAL SHOCK
125 100 TEMPERATURE (C) 75 50 25 0
MAX6629-32 toc05
12 10 TEMPERATURE ERROR (C) 8 6
VIN = SQUARE WAVE APPLIED TO VCC WITH NO 0.1F CAPACITOR
VIN = 250mVP-P 4 2 0 10 100 1k 10k 100k 1M 10M 100M FREQUENCY (Hz)
-2
0
2
4
6 TIME (s)
8
10
12
14
Pin Description
PIN MAX6629 MAX6631 1 2 MAX6630 MAX6632 2 1 N.C. GND No Connect. Connect to ground plane for better thermal performance to the PC board. Ground Supply Voltage Input. Bypass VCC to GND with a 0.1F capacitor. VCC can also be powered from a logic output as long as the voltage level is greater than 3.0V and the logic output is not noisy. Setting the logic output low provides a hardware shutdown mode. Serial Clock Input Chip-Select Input. Enables the interface. A rising edge off CS initiates the next conversion. Pulling CS low initiates an idle state. Serial Data Output Exposed Pad (TDFN only). Connect to GND or leave unconnected. NAME FUNCTION
3
3
VCC
4 5 6 --
4 5 6 --
SCK CS SO EP
4
_______________________________________________________________________________________
12-Bit + Sign Digital Temperature Sensors with Serial Interface
Detailed Description
The MAX6629-MAX6632 are local digital temperature sensors with a serial bus. The MAX6629-MAX6632 are typically interfaced to a C in temperature sensing and control applications. The MAX6629-MAX6632 convert temperature to a 12-bit + sign word with a 0.0625C LSB. The data is communicated through a simple serial interface with a CS (chip select) line, SO (data) line, and SCK (clock) line. This interface can be directly connected to, and is fully compatible with, SPI interfaces. This interface can also be connected to virtually any processor, which has at least three general-purpose input/output (GPIO) lines available to implement software "bit banging." The high resolution of the MAX6629-MAX6632 makes them especially useful in thermal control loops, HVAC systems, or in any system where quick anticipation of temperature trends is useful. The MAX6629-MAX6632 can produce temperature data in excess of +150C, although they are specified for a maximum operating temperature of +150C. This extended temperature range makes it especially useful in automotive underhood applications. The low power consumption is also ideal in battery-operated and portable applications. The MAX6631/MAX6632 are optimized for minimum power consumption with their 8s conversions. The MAX6629/MAX6630 provide faster conversions, 0.5s, at the expense of power consumption. The low quiescent supply current enables the device to be powered from a logic line or the output of a gate where the high level exceeds 3V, as shown in Figure 1.While the MAX6629-MAX6632 are not specifically equipped with a software shutdown mode, the hardware shutdown can easily be implemented by setting the gate output to low. Pulling CS low without a clock also puts the device in idle mode. Take care to ensure that the logic output
LOGIC LINE WHERE VLOGIC > 3V VCC
MAX6629-MAX6632
MAX6629 MAX6630 MAX6631 MAX6632
GND
SO SCK CS
Figure 1. Powering the Sensor from a Logic Gate
is not noisy, as excessive noise on VCC can affect temperature measurement accuracy.
ADC Conversion Sequence
The MAX6629-MAX6632 continuously convert temperature to digital data. Setting CS low stops any conversion in progress, places the device in idle mode, and makes data available for reading. Setting CS high starts a new conversion. CS must remain high for at least 0.3s to allow for the conversion to be completed. Figure 2 shows the timing relationship between conversion time and conversion rate.
SPI Digital Interface
The MAX6629-MAX6632 are compatible with SPI serial-interface standards (Figure 3) and are designed to be read-only devices. CS's rising edge always starts a new conversion and resets the interface. CS must stay high for a minimum of 300ms to allow the conversion to
MAX6629 MAX6630 0.25s ADC CONVERSION TIME
MAX6629 MAX6630 CONVERSION PERIOD 0.5s
MAX6631 MAX6632 0.25s ADC CONVERSION TIME
MAX6631 MAX6632 CONVERSION PERIOD 8s
Figure 2. Conversion Time and Rate Relationships
_______________________________________________________________________________________ 5
12-Bit + Sign Digital Temperature Sensors with Serial Interface MAX6629-MAX6632
tCSS CS
SCK tDV SO D15 D3 D2 D1 D0 tDO tTR
Figure 3. SPI Timing Diagram
Table 1. Data Output Format
D15 Sign D14 MSB Data D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 LSB Data D2 Low D1 High-Z D0 High-Z
Table 2. Temperature Data Format (Two's Complement)
TEMPERATURE (C) 150 125 25 0.0625 0 -0.0625 -25 -55 DIGITAL OUTPUT (BINARY) D15-D3 0,1001,0110,0000 0,0111,1101,0000 0,0001,1001,0000 0,0000,0000,0001 0,0000,0000,0000 1,1111,1111,1111 1,1110,0111,0000 1,1100,1001,0000 D2 0 0 0 0 0 0 0 0 D1, D0 XX XX XX XX XX XX XX XX
undefined and are always in high-impedance mode (Table 1). The power-up state for SO is high impedance. Figure 3 shows the detailed serial timing specifications for the SPI port. The temperature data format is in two's complement format (Table 2).
Power Shutdown Mode
The MAX6629-MAX6632 do not have a built-in power software shutdown mode. However, a power shutdown mode is easily implemented utilizing an unused logic gate. A typical CMOS or TTL logic output has enough drive capability to serve as the power source if its output voltage level exceeds 3V, as shown in Figure 1. Drive the logic output low to provide a hardware shutdown mode.
Idle Mode
finish. CS's falling edge stops any conversion in progress, and data is latched into the shift register. Then the data clocks out at SO on SCK's falling edge with the sign bit (D15) first, followed by the MSB. Data is sent in one 16-bit word, and CS must remain low until all 16 bits are transferred. If CS goes high in the middle of a transmission, it is necessary to wait the conversion time (less than 300ms) before attempting a new read. The serial data is composed of 12 + 1 data bits (D15-D3) and 3 trailing bits (D2-D0). D2 is always low, serving as the confirmation bit that the device has been communicated with. The last 2 bits, D0 and D1, are The MAX6629-MAX6632 can be put into idle mode by pulling CS low. Data can be clocked out when the device is in idle mode.
Power-On Reset (POR)
The POR supply voltage of the MAX6629-MAX6632 is typically 1.6V. Below this supply voltage, the interface is inactive and the data register is set to the POR state, 0C. When power is first applied and VCC rises above 1.6V (typ), the device starts to convert, although temperature reading is not recommended at VCC levels below 3.0V.
6
_______________________________________________________________________________________
12-Bit + Sign Digital Temperature Sensors with Serial Interface
Applications Information
Thermal Considerations
The key to accurate temperature monitoring is good thermal contact between the MAX6629-MAX6632 package and the object being monitored. In some applications, the 6-pin SOT23 package is small enough to fit underneath a socketed P, allowing the device to monitor the P's temperature directly. Accurate temperature monitoring depends on the thermal resistance between the object being monitored and the MAX6629-MAX6632 die. Heat flows in and out of plastic packages primarily through the leads. If the sensor is intended to measure the temperature of a heat-generating component on the circuit board, it should be mounted as close as possible to that component and should share supply and ground traces (if they are not noisy) with that component where possible. This maximizes the heat transfer from the component to the sensor. The MAX6629/MAX6630 supply current is typically 200A, and the MAX6631/MAX6632 supply current is typically 32A. When used to drive high-impedance loads, the device dissipates negligible power. Therefore, the die temperature is essentially the same as the package temperature. The rise in die temperature due to self-heating is given by the following formula: TJ = PDISSIPATION x JA where P DISSIPATION is the power dissipated by the MAX6629-MAX6632, and JA is the package's thermal resistance. The typical thermal resistance is +110C/W for the 6-pin SOT23 package. To limit the effects of self-heating, minimize the output currents. For example, if the MAX6629-MAX6632 sink 1mA, the output voltage is guaranteed to be less than 0.4V. Therefore, an additional 0.4mW of power is dissipated within the IC. This corresponds to a 0.044C shift in the die temperature in the 6-pin SOT23.
MAX6629 MAX6630 MAX6631 MAX6632
TEMPERATURE SENSOR 12-BIT + SIGN ADC VOLTAGE REFERENCE
Functional Diagram
MAX6629-MAX6632
SPI-COMPATIBLE INTERFACE
CS SCK SO
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a "+", "#", or "-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE 6 SOT23 6 TDFN-EP PACKAGE CODE U6FH-6 T633+2 DOCUMENT NO. 21-0058 21-0137
_______________________________________________________________________________________
7
12-Bit + Sign Digital Temperature Sensors with Serial Interface MAX6629-MAX6632
Revision History
REVISION NUMBER 0 1 REVISION DATE 5/01 7/01 Initial release of MAX6629 Initial release of MAX3360, MAX3361, and MAX3362; changed ICONV from 600A (max) to 650A (max) in the Electrical Characteristics table Changed the lead temperature in the Absolute Maximum Ratings section, replacing Note 2 with +300C (removed the JEDEC solder reflow boiler plating due to high temp solder paste for flip chips now in production) Added the TDFN package Added "+" to TDFN packages in the Ordering Information table 4 5/10 Added soldering information to the Absolute Maximum Ratings section Added the TDFN exposed pad information to the Pin Description table DESCRIPTION PAGES CHANGED -- 1, 2
2 3
4/04 8/05
2 1, 2, 9 1 2 4
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
8 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 (c) 2010 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.


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